TEC1-12706 12708 12709 12710 12712 12715 40*40mm 12V Semiconductor Refrigeration Thermoelectric Cooler Peltier Elemente Module

TEC1-12710 TEC1-12712 TEC1-12715 TEC1-12706 TEC1-12708 TEC1-12709

TEC Thermoelectric Heatsink Cooler Cooling Peltier Plate Module

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Description :

Get ice cold in minutes or heat to boiling by simply reversing the polarity, used for numerous applications from CPU coolers to alternate power sources, or even for your own
custom car drink warmer/cooler.
Since they consit primarily of semiconductor material sandwiched between ceramic plates and have no moving parts
These devices must be used in conjunction with a heat sink to avoid burned
Each device is full inspected and tested

TEC1-12703 40*40 12V3A

Model:TEC1-12703

Rated voltage:12V

Rated current:3A

Cooling capacity:29.7W

Maximum temperature difference:65 °

Dimensions:40*40*4.6

Positive and negative:Red positive, black negative

TEC1-12704 40*40 12V4A

Chip type: TEC1-12704
Overall dimensions: 40*40*4.0mm element 127
Wire specification: lead length 300 + 5mm RV standard wire single head 5mm tin plating
Internal resistance: 3.0~3.3 ohm (ambient temperature 23 - 1 DEG C, 1kHZ Ac)
Maximum temperature: Tmax (Qc=0) 63 DEG C.
Working current: Imax=4A (rated voltage)
Rated voltage: DC12V (Vmax:15.5V)
Cooling power: Qcmax 36W
Assembly pressure: 85N/cm2
Working environment: temperature range -55 DEG C to 83 C (high ambient temperature will directly affect the efficiency of refrigeration)
Packaging: Standard 704 silicone rubber seal
Packaging standard: foam box packaging, storage conditions ambient temperature -10 C ~ 40 C
Storage conditions: -40~60

TEC1-12705 40*40

Chip Type: TEC1-12705 

Dimensions: 40 * 40 * 3.8mm element number 127 on 

Internal resistance: 2.5 ~ 2.8Ω (ambient temperature of 23 ± 1 , 1kHZ Ac test) 

Maximum temperature:  Tmax (Qc = 0) over 67 . 

Working current: Imax = 4.3-4.6A (rated at 12V) 

Rated voltage: 12V (Vmax: 15V starting current 5.8A) 

Refrigeration power: Qcmax 50-60W 

Working environment: temperature range -55  ~ 83  (high ambient temperatures drop directly affect the cooling efficiency) 

Packaging process: four weeks standard 704 silicone rubber seal

TEC1-12706 40*40

Chip Type: TEC1-12706
External dimensions: 40 * 40 * 3.75mm
Internal resistance: 2.1 ~ 2.4Ω (ambient temperature of 23 ± 1 'C, 1kHZ Ac test)
The maximum temperature difference:  Tmax (Qc = 0) above 59 'C.
Working current: Imax = 4.3-4.6A (rated at 12V)
Rated voltage: 12V (Vmax: 15V starting current 5.8A)
Cooling power: Qcmax 55W
Working environment: temperature range -55 'C ~ 83'C (high ambient temperature drop directly affect the cooling efficiency)

TEC1-12708 40*40

Chip Type: TEC1-12708

External dimensions: 40 * 40 * 3.5mm

Internal resistance: 1.5 ~ 1.8 Ω (23 + / - 1degree, environment temperature 1 KHZ Ac test)

The largest temperature difference: delta Tmax (Qc = 0) more than 67degree

Working current: Imax = 8 (rated voltage startup)

Rated voltage: DC12V (Vmax: 15.5 V)

Cooling power: 77 w Qcmax

The assembly pressure: 85 n/cm2

Working conditions: temperature range and 55degree~ 83degree (high environmental temperature will directly affect the cooling efficiency)

Encapsulation process: standard around 704 silicone rubber seal

Packing: bubble box packing, storing conditions - 10degree to 40degree ambient temperature

Storage conditions: - 40 ~ 60degree

TEC1-12709 40*40MM

Chip Model: tec1-12709

Overall dimensions: 40*40*3.5mm component Logarithm 127 pairs

Wire specification: lead long 300±8mm RV standard conductor single head 5mm tin plating

Internal resistance: 1.4~1.5ω (ambient temperature 23±1°, 1kHZ AC test)

Maximum temperature difference: 62 ° above

Working current: imax=7.1A (max voltage. 5V start 9A)

Rated Voltage: $literal (maximum voltage: 5V)

Cooling power: 86W (high cooling surface temperature will reduce cooling power)

Assembling pressure: 85n/cm2

Working environment: Temperature range -55°~83° (high ambient temperature will directly affect refrigeration efficiency)

Packaging process: Ambient standard 704 Silicone rubber seal

Packaging standards: Foam box packaging, storage conditions ambient temperature -10°~40°

Storage conditions:-40~60°

Power Requirements: Single voltage 12V, current 9A above the working power supply (series and parallel use)

Device characteristics: Red line positive, black line negative (there is literally refrigeration surface, no literal heat dissipation surface)

TEC1-12710 40*40

Chip: TEC1-12710

Dimension: 40 * 40 127 * 3.4 mm components logarithmic

Wire specifications: 300 + / - 5 mm long RV lead wire single head 5 mm tin plating

Internal resistance value: 1.2 ~ 1.5 Ω (23 + / - 1degree, environment temperature 1 KHZ Ac test)

Maximum temperature difference: delta Tmax (Qc = 0) above 60degree.

Working current: Imax = 10 a voltage (vmax 15 starts)

Rated voltage: DC12V (Vmax: 15.5 V)

Cooling power: 92 w Qcmax

The assembly pressure: 85 n/cm2

Working conditions: temperature range and 55degree ~ 83degree (high environmental temperature will directly affect the cooling efficiency)

Encapsulation process: standard around 704 silicone rubber seal

Packing: bubble box packing, storing conditions - 10degree to 40degree ambient temperature

Storage conditions: - 40 ~ 60degree

TEC1-12712 40*40

Type: TECI-12712

Couples: 127

Imax (A): 12

Umax (V):15.4

Qcmax(w) T =0: 109

Tmax (°) Qc=0: 68

Size: 40*40*3.4mm

TEC1-12715 40*40

Model: TEC1-12715 

Size: 40mm x 40mm x 4mm 

Operates from 0~15.4V DC and 0~15A 

Operates Temperature: -40 to 90 

Max power consumption: 165 Watts